At NSN Unlimited, we maintain a large database of parts 85983800-03, 82S181, 14319703-02, 14319700 with NSN 5962-01-135-2115 used in civil and defense applications for the aerospace, marine, and commercial manufactured by General Dynamics Corporation, General Dynamics Information Systems, Philips Semiconductors Ltd. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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Alternative NSN: 5962-01-135-2115 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011352115 |
NCB Code: USA (01) |
Manufacturers: General Dynamics Corporation , General Dynamics Information Systems , Philips Semiconductors Ltd |
Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
---|---|---|---|---|---|
85983800-03 | 5962-01-135-2115 | microcircuit memory | general dynamics corporation | Avl | RFQ |
85983800-03 | 5962-01-135-2115 | microcircuit memory | general dynamics information systems | Avl | RFQ |
82S181 | 5962-01-135-2115 | microcircuit memory | philips semiconductors ltd | Avl | RFQ |
14319703-02 | 5962-01-135-2115 | microcircuit memory | general dynamics corporation | Avl | RFQ |
14319703-02 | 5962-01-135-2115 | microcircuit memory | general dynamics information systems | Avl | RFQ |
14319700 | 5962-01-135-2115 | microcircuit memory | general dynamics information systems | Avl | RFQ |
14319700 | 5962-01-135-2115 | microcircuit memory | general dynamics corporation | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | AMCS 82577 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.2 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
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