At NSN Unlimited, we maintain a large database of parts ROM PROM FAMILY 023, AM27S29DMB, 71320712-007, 71311301-001 with NSN 5962-01-143-5797 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Advanced Micro Devices Inc, Dla Land And Maritime. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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| Alternative NSN: 5962-01-143-5797 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011435797 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc , Dla Land And Maritime |
| Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
|---|---|---|---|---|---|
| ROM PROM FAMILY 023 | 5962-01-143-5797 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| ROM PROM FAMILY 023 | 5962-01-143-5797 | microcircuit memory | dla land and maritime | Avl | RFQ |
| AM27S29DMB | 5962-01-143-5797 | microcircuit memory | dla land and maritime | Avl | RFQ |
| AM27S29DMB | 5962-01-143-5797 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| 71320712-007 | 5962-01-143-5797 | microcircuit memory | dla land and maritime | Avl | RFQ |
| 71320712-007 | 5962-01-143-5797 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| 71311301-001 | 5962-01-143-5797 | microcircuit memory | dla land and maritime | Avl | RFQ |
| 71311301-001 | 5962-01-143-5797 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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