At NSN Unlimited, we maintain a large database of parts ROM PROM FAMILY 023, AM27S29DB, 973097-0421, 971745 with NSN 5962-01-194-1347 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Advanced Micro Devices Inc, Dla Land And Maritime. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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| Alternative NSN: 5962-01-194-1347 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011941347 |
| NCB Code: USA (01) |
| Manufacturers: Advanced Micro Devices Inc , Dla Land And Maritime |
| Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
|---|---|---|---|---|---|
| ROM PROM FAMILY 023 | 5962-01-194-1347 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| ROM PROM FAMILY 023 | 5962-01-194-1347 | microcircuit memory | dla land and maritime | Avl | RFQ |
| AM27S29DB | 5962-01-194-1347 | microcircuit memory | dla land and maritime | Avl | RFQ |
| AM27S29DB | 5962-01-194-1347 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| 973097-0421 | 5962-01-194-1347 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| 973097-0421 | 5962-01-194-1347 | microcircuit memory | dla land and maritime | Avl | RFQ |
| 971745 | 5962-01-194-1347 | microcircuit memory | dla land and maritime | Avl | RFQ |
| 971745 | 5962-01-194-1347 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.125 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | SCHOTTKY AND HERMETICALLY SEALED AND BIPOLAR AND HIGH RELIABILITY |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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