At NSN Unlimited, we maintain a large database of parts ROM PROM FAMILY 020, MD2716 B, MCM2716BJXC, AM2716DMB, 10104660-T101 with NSN 5962-01-232-5453 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Dla Land And Maritime, Intel Corporation, Freescale Semiconductor Inc, Advanced Micro Devices Inc, Honeywell International Inc. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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Alternative NSN: 5962-01-232-5453 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012325453 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Intel Corporation , Freescale Semiconductor Inc , Advanced Micro Devices Inc , Honeywell International Inc |
Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
---|---|---|---|---|---|
ROM PROM FAMILY 020 | 5962-01-232-5453 | microcircuit memory | dla land and maritime | Avl | RFQ |
MD2716 B | 5962-01-232-5453 | microcircuit memory | intel corporation | Avl | RFQ |
MCM2716BJXC | 5962-01-232-5453 | microcircuit memory | freescale semiconductor inc | Avl | RFQ |
AM2716DMB | 5962-01-232-5453 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
10104660-T101 | 5962-01-232-5453 | microcircuit memory | honeywell international inc | Avl | RFQ |
10104660-101 | 5962-01-232-5453 | microcircuit memory | honeywell international inc | Avl | RFQ |
10069392-101 | 5962-01-232-5453 | microcircuit memory | honeywell international inc | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+100.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | PROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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