At NSN Unlimited, we maintain a large database of parts ROM PROM HEAD 249, PAL16L8AMWB, PAL16L8AMW 883B, AMPAL16L8A BSA, 8103607SA with NSN 5962-01-265-5983 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Dla Land And Maritime, Texas Instruments Incorporated, Mmi Amd, Advanced Micro Devices Inc. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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| Alternative NSN: 5962-01-265-5983 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012655983 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Texas Instruments Incorporated , Mmi Amd , Advanced Micro Devices Inc |
| Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
|---|---|---|---|---|---|
| ROM PROM HEAD 249 | 5962-01-265-5983 | microcircuit memory | dla land and maritime | Avl | RFQ |
| PAL16L8AMWB | 5962-01-265-5983 | microcircuit memory | texas instruments incorporated | Avl | RFQ |
| PAL16L8AMW 883B | 5962-01-265-5983 | microcircuit memory | mmi amd | Avl | RFQ |
| AMPAL16L8A BSA | 5962-01-265-5983 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| 8103607SA | 5962-01-265-5983 | microcircuit memory | dla land and maritime | Avl | RFQ |
| 81036 | 5962-01-265-5983 | microcircuit memory | dla land and maritime | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.092 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
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