At NSN Unlimited, we maintain a large database of parts MR2764A-25 B, MR2764A 25 B, AM2764A-25BUC, 795072-1 with NSN 5962-01-274-7052 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Rochester Electronics Llc, Dla Land And Maritime, Intel Corporation, Advanced Micro Devices Inc, Hamilton Sundstrand Corporation. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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| Alternative NSN: 5962-01-274-7052 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012747052 |
| NCB Code: USA (01) |
| Manufacturers: Rochester Electronics Llc , Dla Land And Maritime , Intel Corporation , Advanced Micro Devices Inc , Hamilton Sundstrand Corporation |
| Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
|---|---|---|---|---|---|
| MR2764A-25 B | 5962-01-274-7052 | microcircuit memory | rochester electronics llc | Avl | RFQ |
| MR2764A-25 B | 5962-01-274-7052 | microcircuit memory | dla land and maritime | Avl | RFQ |
| MR2764A 25 B | 5962-01-274-7052 | microcircuit memory | intel corporation | Avl | RFQ |
| AM2764A-25BUC | 5962-01-274-7052 | microcircuit memory | dla land and maritime | Avl | RFQ |
| AM2764A-25BUC | 5962-01-274-7052 | microcircuit memory | advanced micro devices inc | Avl | RFQ |
| AM2764A-25BUC | 5962-01-274-7052 | microcircuit memory | intel corporation | Avl | RFQ |
| AM2764A-25BUC | 5962-01-274-7052 | microcircuit memory | rochester electronics llc | Avl | RFQ |
| 795072-1 | 5962-01-274-7052 | microcircuit memory | rochester electronics llc | Avl | RFQ |
| 795072-1 | 5962-01-274-7052 | microcircuit memory | intel corporation | Avl | RFQ |
| 795072-1 | 5962-01-274-7052 | microcircuit memory | hamilton sundstrand corporation | Avl | RFQ |
| 795072-1 | 5962-01-274-7052 | microcircuit memory | dla land and maritime | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | F/A-18 HORNET AIRCRAFT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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