At NSN Unlimited, we maintain a large database of parts HM-6501-2, B5271, 477-1568-001 with NSN 5962-01-295-2356 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Intersil Inc, Intersil Communications Inc, Boeing Company The. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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| Alternative NSN: 5962-01-295-2356 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012952356 |
| NCB Code: USA (01) |
| Manufacturers: Intersil Inc , Intersil Communications Inc , Boeing Company The |
| Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
|---|---|---|---|---|---|
| HM-6501-2 | 5962-01-295-2356 | microcircuit memory | intersil inc | Avl | RFQ |
| HM-6501-2 | 5962-01-295-2356 | microcircuit memory | intersil communications inc | Avl | RFQ |
| HM-6501-2 | 5962-01-295-2356 | microcircuit memory | boeing company the | Avl | RFQ |
| B5271 | 5962-01-295-2356 | microcircuit memory | boeing company the | Avl | RFQ |
| B5271 | 5962-01-295-2356 | microcircuit memory | intersil communications inc | Avl | RFQ |
| B5271 | 5962-01-295-2356 | microcircuit memory | intersil inc | Avl | RFQ |
| 477-1568-001 | 5962-01-295-2356 | microcircuit memory | intersil inc | Avl | RFQ |
| 477-1568-001 | 5962-01-295-2356 | microcircuit memory | boeing company the | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.100 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.380 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND ELECTROSTATIC SENSITIVE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
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