At NSN Unlimited, we maintain a large database of parts HM4-65162B-8, 6116S70L B, 14987200-19 with NSN 5962-01-334-6777 used in civil and defense applications for the aerospace, marine, and commercial manufactured by Intersil Inc, Intersil Communications Inc, Integrated Device Technology Inc, General Dynamics Information Systems. Utilize our interface to browse items by part number, part type, manufacturer, and more. Obtain insights on top MRO and FBO services, Manufacturer profiles, and part catalogs.
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| Alternative NSN: 5962-01-334-6777 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013346777 |
| NCB Code: USA (01) |
| Manufacturers: Intersil Inc , Intersil Communications Inc , Integrated Device Technology Inc , General Dynamics Information Systems |
| Part No | NSN | Item Name | Manufacturer | QTY | RFQ |
|---|---|---|---|---|---|
| HM4-65162B-8 | 5962-01-334-6777 | microcircuit memory | intersil inc | Avl | RFQ |
| HM4-65162B-8 | 5962-01-334-6777 | microcircuit memory | intersil communications inc | Avl | RFQ |
| HM4-65162B-8 | 5962-01-334-6777 | microcircuit memory | integrated device technology inc | Avl | RFQ |
| HM4-65162B-8 | 5962-01-334-6777 | microcircuit memory | general dynamics information systems | Avl | RFQ |
| 6116S70L B | 5962-01-334-6777 | microcircuit memory | general dynamics information systems | Avl | RFQ |
| 6116S70L B | 5962-01-334-6777 | microcircuit memory | integrated device technology inc | Avl | RFQ |
| 14987200-19 | 5962-01-334-6777 | microcircuit memory | integrated device technology inc | Avl | RFQ |
| 14987200-19 | 5962-01-334-6777 | microcircuit memory | general dynamics information systems | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.075 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND POSITIVE OUTPUTS |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4A MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
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