MRC | Criteria | Characteristic |
---|---|---|
AFGA | OPERATING TEMP RANGE | -0.0/+70.0 DEG CELSIUS |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.255 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.870 INCHES MAXIMUM |
CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 325.0 MILLIWATTS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
AFJQ | STORAGE TEMP RANGE | 65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMABLE AND W/OPEN COLLECTOR AND HERMETICALLY SEALED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.155 INCHES MAXIMUM |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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