NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-391-3735 Item Description: Semiconductor Devic | 5961 | 013913735 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | G | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
1n6657ltxv | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.990 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.560 INCHES MAXIMUM |
PMLC | III PRECIOUS MATERIAL AND LOCATION | TERMINAL AREAS IAW MIL-STD-2000 PARA. 5.4.17.2 GOLD |
AKPV | MOUNTING FACILITY QUANTITY | 4 |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR |
TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 DEG CELSIUS JUNCTION |
ASCK | RESPONSE TIME | 35.0 NANOSECONDS MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-254AA |
CTQX | CURRENT RATING PER CHARACTERISTIC | 40.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE AND 400.00 AMPERES MAXIMUM PEAK FORWARD SURGE CURRENT ALL SEMICONDUCTOR DEVICE DIODE |
PRMT | III PRECIOUS MATERIAL | GOLD |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | TERMINAL AND UNTHREADED HOLE |
ABMK | OVERALL WIDTH | 0.545 INCHES MAXIMUM |
TEST | TEST DATA DOCUMENT | 35351-171280 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
ABBH | INCLOSURE MATERIAL | CERAMIC |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS AND 100.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE |
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