NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-344-5690 Item Description: Semiconductor Devic | 5961 | 013445690 | 0 | N | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Byv44-300 | 5 | 1 | C | A |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | PLASTIC OR CERAMIC |
ABHP | OVERALL LENGTH | 15.8 MILLIMETERS MAXIMUM |
ABJT | TERMINAL LENGTH | 13.5 MILLIMETERS MINIMUM |
ABKW | OVERALL HEIGHT | 4.5 MILLIMETERS MAXIMUM |
ABMK | OVERALL WIDTH | 10.3 MILLIMETERS MAXIMUM |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 300.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 30.00 AMPERES FORWARD CURRENT, AVERAGE MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-220AB |
AXGY | MOUNTING METHOD | TERMINAL |
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