NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-414-9170 Item Description: Semiconductor Devic | 5961 | 014149170 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mmbd7000lt1 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
AXGY | MOUNTING METHOD | TERMINAL |
TTQY | TERMINAL TYPE AND QUANTITY | 3 BONDING PAD |
ABBH | INCLOSURE MATERIAL | PLASTIC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC AND 500.00 MILLIAMPERES MAXIMUM PEAK FORWARD SURGE CURRENT |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
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