NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-004-0278 Item Description: Microcircuit Memory | 5962 | 000040278 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
100337-701 | C | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.200 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.580 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.230 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 650.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -25.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-015-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -30.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 31935-100337 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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